Tsinghua Unigroup Closes US$907 Million Acquisition of RDA Workers test at TongFu Microelectronics Co., Ltd, an IC package in Nan-tong in east China's Jiangsu province on Nov. 14, 2020. According to Shi Lei, the president of Tongfu Microelectronics Co, the company's overall sales revenue for this year is expected to surpass 10 billion yuan. Unfortunately, you don't own enough credit to see this new org chart. April 29th of 2016, marks the date when TFME (TongFu Microelectronics 通富微电) closed the transaction by acquiring 85% of AMD stake in two locations, AMD Penang, Malaysia . Issuer . 2.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers. There are no changes in product electrical specifications. TongFu Microelectronics ; ITEQ Corporation ; Powertech Technology Inc. (PTI) TSHT; Market segmentation of IC Packaging and Testing Equipment market: IC Packaging and Testing Equipment market is divided by type and application. Morningstar Rating. read more. Stock analysis for TongFu Microelectronics Co Ltd (002156:Shenzhen) including stock price, stock chart, company news, key statistics, fundamentals and company profile. View 002156.CN financial statements in full. The company has 2 major shareholders. The project was the first important investment project for the company to complete the landing signing ceremony. Report available on November 15, 2021. TongFu Microelectronics Co Ltd operates in the semiconductor industry. To continue, you can add a name in one of the org charts you recently viewed or test our Premium . Tongfu Microelectronics (TFME, 通富微电子) is a provider of integrated circuit (IC) assembling and testing services to the semiconductor industry. Address 288 Chongchuan Road Nantong, 226006 China. Prior to TongFu， Michael was with XMC/YMTC as . Picture source:Futu. See Chinese trade for Xiamen Tongfu Microelectronics Co., Ltd. Reserved Tongfu Microelectronics Co. Ltd. Nantong Fujitsu Microelectronics Co., Ltd. TFME. the qualifications of TO247 FSIII in ON Semiconductor Vietnam as additional assembly and final test site, apart from Tongfu Microelectronics (TFME), China. Tongfu Microelectronics [SHE: 002156] shares slumped 5 percent in the morning since the additional share issuance will dilute existing shareholders' rights and interests. TongFu Microelectronics (TFME) is a leading IC package and testing enterprise in China and bought over AMD's factories in Suzhou and Penang through fundings by China's National Integrated Circuit . The memory packaging market will grow to $20B in 2026. The company provides customers with a full range of . Company Description: Tongfu Microelectronics Co., Ltd. is located in Nantong, Jiangsu, China and is part of the Scientific Research and Development Services Industry. The P/Earnings NTM ratio of TongFu Microelectronics Co., Ltd. is significantly higher than the average of its sector (Semiconductors): 18.95. The company is specializing in integrated circuit assembling and testing. Bhd.) It offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high . It includes HS product codes and with their dollar values. Fair Value is the appropriate price for the shares of a company, based on . Effective July 3rd, 2017 TongFu product currently picked up in Chiba Japan will no longer be available for pick up at that location. The sales revenue of Tongfu Microelectronics in 2019 grew more than 10 percent year-on-year in 2019. In the introductory part of the chapter, details about global IC Packaging and Testing market figures, both historical . The company provides customers with a full range of test platforms and engineering services to support a wide range of analog and mixed . TF AMD Microelectronics (Penang) Sdn. The 2020 mid-year report shows that The company achieved operating income of 4.67 billion yuan, a year-on-year increase of 30.17%; net profit of 111 million yuan, a year-on-year decrease of 243.54%; earnings per share of 0.10 yuan. TongFu Microelectronics Co., Ltd. engages in the business of integrated circuit assembling and testing. Shi also expects the sales revenue for the plant in Su-Xi-Tong Park to grow by more than . Tongfu may refer to: Olyphant & Co. ( Chinese: 同孚洋行; pinyin: Tóngfú Yángháng ), was a merchant trading house or hong in 19th-century China. TONGFU MICROELECTRONICS CO., LTD, formerly Nantong Fujitsu Microelectronics Co., Ltd., is a China-based company, principally engaged in the packaging and testing of integrated circuits (ICs). Harness the power of your relationships with RelSci Pro, the powerful platform for identifying relationship-driven business opportunities and connections that can propel your career forward. Tongfu Microelectronics Co., Ltd. has 13,594 total employees across all of its locations and generates $1.64 billion in sales (USD). Chinese Trade Data is another data source separate from US import data. See Chinese trade for Hefei Tongfu Microelectronics Co., Ltd. Home; About TFME Date of Sample Received :.11 May 2017. Dublin, Feb. 20, 2020 (GLOBE NEWSWIRE) -- The "Development of the Global IC Packaging and Testing Industry, 2019 and Beyond " report has been added . The company has 2 major shareholders. Sample Shipment From Tongfu Microelectronics Co Ltd Bill of Lading MLCWPVG18110484. The Company conducts its business within domestic and overseas markets. TONGFU MICROELECTRONICS CO., LTD, formerly Nantong Fujitsu Microelectronics Co., Ltd., is a China-based company, principally engaged in the packaging and testing of integrated circuits (ICs). The ramp-up of Chinese memory, the growth of flip-chip DRAM, and the rise of 3D-stacking technologies are opening significant opportunities for packaging players. Its products include dual in-line package, small outline package, quad flat package, system . Testing Period :.11 May 2017 - 16 May 2017. Complete coverage for 58 HS codes. The stock name is "TongFuWeiDian" with code 002156. TongFu Microelectronics Co., Ltd. engages in the business of integrated circuit assembling and testing. Quote Stock Analysis News Price vs Fair Value Sustainability Trailing Returns Financials Valuation Operating . 0.03 (0.13%) Ex-Dividend Date. CopyRight 2015 All Right Reserved Tongfu Microelectronics Co., Ltd. Close. Forward Dividend & Yield. Upon the expiration of this FPCN, case outline 340AM applies for both Tongfu Microelectronics (TFME) China and On Semiconductor Vietnam Financial values in the chart are available after Tongfu Microelectronics Co., Ltd. report is purchased. Tongfu Microelectronics Co., Ltdの製品・サービス 一覧 Tongfu Microelectronics Co., Ltd へのお問い合わせ お問い合わせいただくにはログインいただき、プロフィール情報を入力していただく必要があります。 Package at Tongfu Microelectronics Co. Ltd China Important information for your attention: Please respond to this PCN by indicating your decision on the approval form, sign it and return to your sales partner before 3rd November 2020. Find detailed stats on Tongfu Microelectronics revenue on Craft. TongFu Microelectronics Co has 13 executives. Tongfu Microelectronics Co.,Ltd was founded in 1997 and is headquartered in Nantong, China. TongFu Microelectronics. China-based OSAT Tongfu Microelectronics plans to raise up to CNY5.5 billion (US$854 million) to fund its upcoming capacity expansions for a variety of segments, according to industry sources. A brief financial summary of TongFu Microelectronics Co Ltd as well as the most significant critical numbers from each of its financial reports. TongFu Microelectronics Co Ltd provides assembling and testing service for memory, microprocessor, micro-controller, hybrid circuit, analog circuit, and other related services throughout China. : SP17-016425 - SUZ. Bhd., the 1st company in the world to assemble and test the leading microprocessor. Get the latest TongFu Microelectronics Co Ltd (002156) real-time quote, historical performance, charts, and other financial information to help you make more informed trading and investment decisions. TongFu Microelectronics Co., Ltd. engages in the business of integrated circuit assembling and testing. Arrival Date: 2018-11-26. Lily Dong, Chief Financial Officer RDA Microelectronics, Inc. +86-21-5027-1108 or Leanne Sievers, EVP Shelton Group Investor Relations 949-224-3874 Rong Chen, Vice President - Investments Tsinghua . AAMI WAS AWARDED THREE MAJOR OF HONOURS OF HUATIAN TECHNOLOGY (XI'AN) CO., LTD. Topics referred to by the same term. Implementation of matrix leadframe for Package PG-TO252-3 in Tongfu Microelectronics Co., Ltd. (TFME) Detailed Change Information: Subject: Implementation of matrix leadframe for Package PG-TO252-3 in Tongfu Microelectronics Co., Ltd. (TFME) Reason: Standardization of leadframe for package PG-TO252-3 in Tongfu Microelectronics Co., Ltd. (TFME) assembly line. For the period 2021-2024, cross-segment growth provides accurate calculations and forecasts of sales by Type and . This web site is not endorsed by, directly affiliated with, maintained, authorized, or sponsored by Hefei Tongfu Microelectronics Co., Ltd.. As one of China's three leading IC backend service firms, Tongfu Microelectronics (TFME) has managed to provide one-stop packaging and testing solutions by expanding its operation bases to offer . Its products include dual in-line package, small outline package, quad flat package, system . with its High Technology Assembly and Test knowhow, have been in Penang since 1972. Stock analysis for TongFu Microelectronics Co Ltd (002156:Shenzhen) including stock price, stock chart, company news, key statistics, fundamentals and company profile. As per the research conducted by MarketsandResearch.biz, the report titled Global IC Packaging and Testing Market 2021 by Company, Regions, Type and Application, Forecast to 2026 includes a lot of details that allow everyone to understand different things without difficulties. The company is specializing in integrated circuit assembling and testing. Bhd. Oct 29, 2021 - Nov 01, 2021. Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) packaging and testing services to the semiconductor industry. The company has 2 major shareholders. . Tongfu Microelectronics' high-end packaging and testing project was launched in Xiamen Haicang. TongFu Microelectronics Co Ltd operates in the semiconductor industry. 1y Target Est. VIDEO FINANCIAL REPORTINGWhy invest in is the first financial video platform where you can easily search through thousands of videos describing global securi. The company was founded. Its products include dual in-line package, small outline package, quad flat package, system . Tongfu（同夫, see tongqi ）, a neologism for men who have married lesbian women. USER LOGIN. Its products include dual in-line package, small outline package, quad flat package, system in package, small outline transistor, dual flat no-lead, quad flat no-lead, ball grid array, flip chip, and bump series. Introduction of TONGFU MICROELECTRONICS as alternate assembly site for TO220 MOSFET Products Important information for your attention: Please respond to this PCN by indicating your decision on the approval form, sign it and return to your sales partner before 18-November-2017 . Tongfu Microelectronics Co.,Ltd's ISS Governance QualityScore as of N/A is N/A. Rating as of Oct 13, 2021. China's manufac-turing activity accelerated in November as its rebound from the pandemic gained strength, a survey showed Monday, Nov. 30, 2020, while the United 28.82. Investor | Service | Contact us | 中文版 Service | Contact us | 中文版. Phone 86 513 8505 8919. Annual and quarterly financial reports, income statements and balance sheets for TongFu Microelectronics Co., Ltd. (002156) on MSN Money. TF AMD Microelectronics (Penang) Sdn. There is neither change in the bill of materials nor manufacturing process. The . The following sample(s) was/were submitted and identified on behalf of the clients as : SOT23-3. Home > Reports & Monitors > Memory Packaging 2021. Chinese Trade Data is another data source separate from US import data. Tongfu Microelectronics Co.,Ltd was founded in 1997 and is headquartered in Nantong, China. Wafer Level Chip Scale Packaging (WLCSP) Market 2021 Analysis by Top Players- Samsung Electronics, Amkor, Semco, Texas Instruments, JCET, PTI, ASE, Tongfu Microelectronics tanmay April 20, 2021 17 Toshimasa Hanaoka is Former Member-Supervisory Board at TongFu Microelectronics Co., Ltd. View Toshimasa Hanaoka's professional profile on Relationship Science, the database of decision makers. 9/15 The First Semiconductor Summit ST is already proceeding Tongfu, Tongxiang (同福乡), a township in Zhejiang province, China. Microelectronics Co., Ltd. to JSI Logistics Ltd. Hong Kong. TongFu Microelectronics FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT reliability@cypress.com or via a CYLINK CRM CASE Prepared By: Hideho Taoka Reviewed By: Kunihiro Miyazono Reliability Engineer Reliability Manager Approved By: David Hoffman Reliability Director One is Nantong Huada Microelectronics Group Ltd. (holding 31.25%) and the other is Fujitsu (China) Limited (holding 21.38%). AAMI WAS AWARDED THE HONOUR OF "EXCELLENT SUPPLIER" BY TONGFU MICROELECTRONICS LIMITED. TongFu Microelectronics Co., Ltd. engages in the business of integrated circuit assembling and testing. 3. All products assembled and/or tested at TongFu Microelectronics Co., Ltd. will be distributed from Hong Kong. Tongfu Microelectronics 's main business is integrated circuit packaging and testing, accounting for 97.96%of revenue. Hefei Tongfu Microelectronics Company Limited (HTF), a qualified manufacturing facility, located in Anhui, China, will be added as a qualified site for assembly and testing of Power Integrations products in the PDIP-8B, PDIP-8C, SMD-8B and SMD-8C packages as listed below. Account： Please fill in the complete e-mail account, or the administrator account. On March 30, 2021, the Tongfu Microelectronics Limited launched the grand opening of its 2021 Annual Suppliers Meeting at Nantong Intercontinental Hotel.
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